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| DATA SHEET PHOTOCOUPLER PS2625, PS2626, PS2625L, PS2626L HIGH ISOLATION VOLTAGE AC INPUT LARGE FORWARD AC INPUT TYPE 6 PIN PHOTOCOUPLER -- NEPOC Series -- DESCRIPTION PS2625, PS2626 and PS2625L, PS2626L are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor. PS2625, PS2626 are in a plastic DIP (Dual In-line Package). PS2625L, PS2626L are lead bending type (Gull-wing) for surface mount. PS2625, PS2625L have base pin and PS2622, PS2622L have no base pin. FEATURES * High isolation voltage (BV: 5 kVr.m.s. MIN.) * AC input response * Large forward input (current) (IF: 150 mA MAX.) * High collector to emitter voltage (VCEO: 80 V MIN.) * High speed switching (tr = 3 s, tf = 5 s TYP.) * UL recognized [File No. E72422(S)] * Taping product name (PS2625L-E3, E4, PS2626L-E3, E4) APPLICATIONS Interface circuit for various instrumentations, control equipments. * AC Line/Digital Logic ............................................................ Isolate high voltage transient * Digital Logic/Digital Logic ..................................................... Eliminate spurious ground loops * Twisted pair line receiver ..................................................... Eliminate ground loop pick-up * Telephone/Telegraph line receiver ...................................... Isolate high voltage transient * High Frequency Power Supply Feedback Control .............. Maintain floating ground Document No. P11293EJ3V0DS00 (3rd edition) (Previous No. LC-2125A) Date Published February 1996 P Printed in Japan (c) 1988 PS2625, PS2626, PS2625L, PS2626L PACKAGE DIMENSIONS (Unit: mm) DIP (Dual In-line Package) PS2625, PS2626 10.16 MAX. 6 4 Lead Bending type (Gull-wing) PS2625L, PS2626L 10.16 MAX. 6 4 1 3.8 MAX. 3 7.62 6.5 3.8 MAX. 1 3 0.05 to 0.2 7.62 6.5 2.8 MIN. 4.55 MAX. 0.65 1.34 2.54 0.50 0.10 2.54 MAX. 0.25 M 2.54 1.34 0.10 0 to 15 2.54 MAX. 0.25 M 0.9 0.25 9.60 0.4 PIN CONNECTION (Top View) PS2625, PS2625L 6 5 4 1. Anode, Cathode 2. Cathode, Anode 3. NC 4. Emitter 5. Collector 6. Base PS2626, PS2626L 6 5 4 1. Anode, Cathode 2. Cathode, Cathode 3. NC 4. Emitter 5. Collector 6. NC 1 2 3 1 2 3 2 PS2625, PS2626, PS2625L, PS2626L ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Diode Forward Current (DC) Power Dissipation Derating Power Dissipation Peak Forward Current (PW = 100 s, Duty Cycle 1 %) Transistor Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Derating Power Dissipation Coupled Isolation Voltage *1) Storage Temperature Operating Temperature BV Tstg Topt 5 000 -55 to +150 -55 to +100 Vr.m.s. C C VCEO VECO IC PC/C PC 80 7 50 1.5 150 V V mA mW/C mW IF PD/C PD IF(Peak) 150 2.0 200 1 mA mW/C mW A *1) AC voltage for 1 minute at TA = 25 C, RH = 60 % between input (Pin No. 1, 2, 3, Common) and output (Pin No. 4, 5, 6 Common). ELECTRICAL CHARACTERISTICS (TA = 25 C) CHARACTERISTIC Diode Forward Voltage Junction Capacitance Transistor Collector to Emitter Dark Current DC Current Gain*2) Coupled Current Transfer Ratio CTR Ratio*3) SYMBOL VF C ICEO MIN. TYP. 1.3 140 100 MAX. 1.7 UNIT V pF nA TEST CONDITIONS IF = 100 mA V = 0, f = 1.0 MHz VCE = 80 V, IF = 0 hFE CTR CTR1/CTR2 20 0.3 700 50 1.0 3.0 0.3 10 11 IC = 2 mA, VCE = 5 V % IF = 100 mA, VCE = 3 V IF = 100 mA, VCE = 3 V V IF = 100 mA, IC = 4 mA Vin-out = 1.0 kV V = 0, f = 1.0 MHz VCC = 5 V, IC = 2 mA, RL = 100 VCC = 5 V, IC = 2 mA, RL = 100 Collector Saturation Voltage VCE(sat) Isolation Resistance Isolation Capacitance Rise Fall Time*4) R1-2 C1-2 tr tf 0.6 3 5 pF s s Time*4) *2) PS2625, PS2625L only *3) IC1 IF1 IC2 IF2 *4) Test Circuit for Switching Time PULSE INPUT PW = 100 s Duty Cycle = 1/10 IC1 IF CTR1 = IF1 , CTR2 = VCC IF2 50 IC2 VOUT RL = 100 3 PS2625, PS2626, PS2625L, PS2626L TYPICAL CHARACTERISTICS (TA = 25 C) DIODE POWER DISSIPATION VS. AMBIENT TEMPERATURE PC - Transistor Power Dissipation - mW PD - Diode Power Dissipation - mW 200 200 TRANSISTOR POWER DISSIPATION VS. AMBIENT TEMPERATURE 150 150 100 100 50 50 0 25 50 75 100 0 25 50 75 100 TA - Ambient Temperature - C FORWARD CURRENT vs. FORWARD VOLTAGE 150 100 IF - Forward Current - mA IF - Forward Current - mA 100 50 0 -50 TA - Ambient Temperature - C FORWARD CURRENT vs. FORWARD VOLTAGE 10 1 100 C 75 C 50 C 25 C 0 C -25 C -55 C 0.1 -100 0.01 0.6 0.8 1 1.2 1.4 1.6 VF - Forward Voltage - V COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE -150 -1.5 -1.0 -0.5 0 0.5 1.0 VF - Forward Voltage - V 1.5 ICEO - Collector to Emitter Dark Current - nA COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE 100 IC - Collector Current - mA IF = 50 mA 20 mA 10000 1000 100 80 V 40 V 24 V 10 V VCE = 5 V 10 1 10 1 10 mA 5 mA 2 mA 1 mA 0.1 0.1 -60 -40 0.01 -20 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1 VCE(sat) - Collector Saturation Voltage - V TA - Ambient Temperature - C 4 PS2625, PS2626, PS2625L, PS2626L NORMALIZED OUTPUT CURRENT vs. AMBIENT TEMPERATURE 1.4 COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE CTR - Normalized Output Current 70 IC - Collector Current - mA 60 50 40 30 20 10 0 2 4 6 8 10 1.2 1 0.8 0.6 0.4 0.2 0 -55 Normalized to 1.0 at TA = 25 C IF = 100 mA, VCE = 3 V -25 0 25 50 75 TA - Ambient Temperature - C SWITCHING TIME vs. LOAD RESISTANCE 100 50 VCC = 10 V IC = 2 mA ton toff 10 5 tf tr 100 mA 50 mA 20 mA 10 IF = 5 mA VCE - Collector to Emitter Voltage - V CURRENT TRANSFER RATIO (CTR) vs. FORWARD CURRENT 250 CTR - Current Transfer Ratio - % VCE = 3 V 150 Sample A B C 100 50 1 50 0 0.1 t - Switching Time - s 200 0.5 1 5 10 50 100 100 IF - Forward Current - mA 500 1k RL - Load Resistance - 2k FREQUENCY RESPONSE CTR DEGRADATION CTR Test condition IF = 5 mA, VCE = 5 V AV - Voltage Gain - dB 0 -3 -6 1k 50 330 F -12 100 1k RL = 100 CTR - Normalized 500 1.0 0.8 0.6 IF = 5 mA IF = 20 mA IF = 40 mA -9 VCC = 5 V RL lC = 2 mA 10k f - Frequency - Hz 100k 0.4 0.2 0 102 103 Time - Hr 104 105 5 The measurement of TYPICAL CHARACTERISTICS are only for reference, not guaranteed. 5 PS2625, PS2626, PS2625L, PS2626L SOLDERING PRECAUTION (1) Infrared reflow soldering * Peak reflow temperature * Reflow time : 235 C or below (Plastic surface temperature) : 30 seconds or less (Time period during which the plastic surface temperature is 210 C) * Number of reflow processes : Three * Flux : Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) INFRARED RAY REFLOW TEMPERATURE PROFILE PACKAGE'S SURFACE TEM (C) (ACTUAL HEAT) to 10 s 235 C MAX. 210 C 120 to 160 C 60 to 90 s (PRE-HEAT) to 30 s TIME (s) Peak Temperature 235 C or Lower (2) Dip soldering * Peak temperature * Time * Flux : : : 260 C or lower 10 s or less Rosin-base flux 6 PS2625, PS2626, PS2625L, PS2626L [MEMO] 7 PS2625, PS2626, PS2625L, PS2626L Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 |
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